TECPACK to Showcase Innovative Logistics Solutions at Logis-Tech Tokyo Innovation Expo 2025

TECPACK TECH CO., LTD, a leader in cutting-edge logistics solutions, is excited to announce its participation in Logis-Tech Tokyo Innovation Expo 2025, taking place from September 10–12 at Tokyo Big Sight.

As a key innovator in the logistics and supply chain industry, TECPACK and Huading Industry will showcase its latest advancements in automated packaging systems, AI-driven logistics management, and sustainable supply chain solutions. Visitors to our booth (Hall 8, Stand 8-607) will experience live demonstrations, interact with our experts, and discover how our technologies optimize efficiency and reduce operational costs.

Event Highlights:

Product Premieres: Debut of next-generation logistics automation technologies

Strategic Networking: Connect with industry leaders and potential partners

Expert Insights: Keynote presentations on the future of intelligent logistics

"We're thrilled to participate in Logis-Tech Tokyo Innovation Expo 2025," said Jessica Wang, Overseas Director at TECPACK. "This event provides the ideal platform to demonstrate how TECPACK is transforming global logistics through innovation."

For media inquiries or meeting requests:

Jessica Wang

Overseas Director

TECPACK TECH CO., LTD

Email: info@tecpacksolutions.com

Phone: +86 151 6660 9111

Visit us at Hall 8, Stand 8-607 to experience the future of logistics technology. Learn more at www.tecpacksolutions.com or follow us on LinkedIn.

About TECPACK TECH CO., LTD

Specializing in intelligent packaging solutions and logistics automation, TECPACK delivers innovative technologies that drive efficiency and sustainability across global supply chains.